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Applied Materials, Inc. (AMAT)

Nasdaq: AMAT · Semiconductors & Related Devices · Santa Clara, CA · filing with the SEC since 1994
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◀ Past 7.6● Present 7.9▶ Future 5.5
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Patents

US patents through Dec 31, 2025 · PatentsView, from the USPTO’s Open Data Portal · read Oct 27, 2026

15,721 patents granted to the 22 names below, as the owner printed on each patent when it was granted. A later sale, a lapse or an expiry is not read, so this is what was granted to Applied Materials, Inc.’s names, not what it holds today.

Patents granted
15,721
15,520 utility, 192 design, 9 reissue, 1976 to Dec 31, 2025
Granted in 2025
831
Against 941 in 2024 and 958 in 2023
Applications published
16,625
1,270 of them in 2025
Names they are printed under
22
its own name, a subsidiary
By yearGrantedApplications published
'11'12'13'14'15'16'17'18'19'20'21'22'23'24'25
Each pair is one calendar year. Applications are published about eighteen months after filing, so the newest years read low.
What they are aboutgrants since 2021
Semiconductors1,838
Electrical machinery, apparatus, energy645
Surface technology, coating595
Optics227
Computer technology226
Measurement169
Machine tools168
Chemical engineering47
Other special machines46
Materials, metallurgy42
Control39
Mechanical elements30
The main technology area of each patent, in the World Intellectual Property Organization’s 35 fields.
Under which name22 counted
Applied Materials, Inc. its own name
US, as the owner printed on each patent. 16 more under the same name are not counted (printed in DE, printed in CA, printed in JP)
13,774 granted
7,297 published
Applied Materials, Inc. its own name
named as the applicant on its applications, in US. 3 more under the same name are not counted (printed in CA)
0 granted
7,541 published
Varian Semiconductor Equipment Associates, Inc. a subsidiary
US, as the owner printed on each patent. 18 more under the same name are not counted (printed in GB)
912 granted
641 published
Applied Materials Israel Ltd. a subsidiary
IL, as the owner printed on each patent. 6 more under the same name are not counted (printed in US, printed in IE, printed in DE)
534 granted
252 published
Semitool, Inc. a subsidiary
US, as the owner printed on each patent
382 granted
145 published
Applied Materials Israel Ltd. a subsidiary
named as the applicant on its applications, in IL. 9 more under the same name are not counted (printed in US)
0 granted
252 published
Varian Semiconductor Equipment Associates, Inc. a subsidiary
named as the applicant on its applications, in US
0 granted
250 published
Applied Materials, Inc., a Delaware corporation its own name
US, as the owner printed on each patent
0 granted
102 published
Picosun Oy a subsidiary
FI, as the owner printed on each patent. 1 more under the same name are not counted (printed in FR)
54 granted
40 published
Picosun Oy a subsidiary
named as the applicant on its applications, in FI
0 granted
42 published
APPLIED MATERIALS ITALIA S.R.L. a subsidiary
IT, as the owner printed on each patent
25 granted
16 published
APPLIED MATERIALS ITALIA S.R.L. a subsidiary
named as the applicant on its applications, in IT
0 granted
26 published
Applied Materials South East Asia Pte. Ltd. a subsidiary
SG, as the owner printed on each patent
18 granted
0 published
Tango Systems, Inc. a subsidiary
US, as the owner printed on each patent
11 granted
5 published
Impedans Ltd a subsidiary
named as the applicant on its applications, in IE
0 granted
9 published
IMPEDANS LTD a subsidiary
IE, as the owner printed on each patent
4 granted
1 published
Tango Systems, Inc. a subsidiary
named as the applicant on its applications, in US
0 granted
5 published
Applied Materials Japan Inc. a subsidiary
JP, as the owner printed on each patent
3 granted
0 published
SAGE DESIGN AUTOMATION LTD a subsidiary
IL, as the owner printed on each patent
2 granted
0 published
Perceptive Engineering Limited a subsidiary
GB, as the owner printed on each patent
1 granted
0 published
Sage Design Automation LTD. a subsidiary
named as the applicant on its applications, in IL
0 granted
1 published
Sigmameltec Ltd. a subsidiary
JP, as the owner printed on each patent
1 granted
0 published
Names not counted (3)
APPLIED MATERIALS INC /DE
Most of its patents print DE; this name counts in US. 35 granted and 13 published under it are not counted.
APPLIED MATERIALS INC /DE
No country is printed for it. 0 granted and 1 published under it are not counted.
Baccini Pte. Ltd.
No country is printed for it. 0 granted and 1 published under it are not counted.
Newest grantseach row opens the USPTO’s own copy
GrantedPatentTitleFieldOwner as printed
Dec 30, 202512,512,362Susceptor improvementSemiconductorsApplied Materials, Inc.
Dec 30, 202512,512,361Semiconductor chamber components with high-performance coatingSemiconductorsApplied Materials, Inc.
Dec 30, 202512,512,358Electrostatically secured substrate support assemblySemiconductorsApplied Materials, Inc.
Dec 30, 202512,512,357Ceramic engineering by grading materialsMaterials, metallurgyApplied Materials, Inc.
Dec 30, 202512,512,347Methods and apparatus for wafer detectionSemiconductorsApplied Materials, Inc.
Dec 30, 202512,512,304Plasma source for semiconductor processingElectrical machinery, apparatus, energyApplied Materials, Inc.
Dec 30, 202512,512,303Soft-chucking scheme for improved backside particle performanceSemiconductorsApplied Materials, Inc.
Dec 30, 202512,511,862Template-based image processing for target segmentation and metrologyComputer technologyApplied Materials, Inc.
Dec 30, 202512,511,720Image denoising for examination of a semiconductor specimenComputer technologyApplied Materials Israel Ltd.
Dec 30, 202512,511,407Methods and mechanisms for secure data sharingComputer technologyApplied Materials, Inc.
Newest applications publishedan application is a clue, never a plan
PublishedApplicationTitleFieldOwner as printed
Dec 25, 20252025/0391809PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDINGSemiconductorsApplied Materials, Inc.
Dec 25, 20252025/0391708SUBSTRATE PROCESSING FOR IMPROVED WAFER THICKNESS UNIFORMITYSemiconductorsApplied Materials, Inc.
Dec 25, 20252025/0391707METHOD AND SYSTEM FOR 3D RECONSTRUCTION OF WAFER STRUCTURE BY DIAGONAL MILLINGElectrical machinery, apparatus, energyApplied Materials Israel Ltd.
Dec 25, 20252025/0391700HYBRID VACUUM ELECTROSTATIC CHUCKSemiconductorsApplied Materials, Inc.
Dec 25, 20252025/0391699HYBRID VACUUM ELECTROSTATIC CHUCK CARRIER FOR HIGH WARPAGE WAFERSSemiconductorsApplied Materials Israel Ltd.
Dec 25, 20252025/0391694SUBSTRATE SUPPORTElectrical machinery, apparatus, energyApplied Materials, Inc.
Dec 25, 20252025/0391693HYBRID VACUUM ELECTROSTATIC CHUCK IN DEDICATED CHAMBER FOR HIGH WARPAGE WAFERSSemiconductorsApplied Materials Israel Ltd.
Dec 25, 20252025/0391692HYBRID VACUUM ELECTROSTATIC CHUCK IN VACUUM CHAMBER FOR HIGH WARPAGE WAFERSSemiconductorsApplied Materials Israel Ltd.
Dec 25, 20252025/0391691DIELECTRIC BOND LAYER FOR JOINING OF DISSIMILAR CERAMIC SEGMENTS OF A SUBSTRATE SUPPORTSemiconductorsApplied Materials, Inc.
Dec 25, 20252025/0391690BRUSH BOX WAFER NOTCH DETECTION METHODS AND EXTENDED FUNCTIONALITYSemiconductorsApplied Materials, Inc.
What it applied for, 2024 to 2025: Semiconductors 1,030 · Electrical machinery, apparatus, energy 407 · Surface technology, coating 346 · Optics 153 · Computer technology 120 · Measurement 103.

A patent is counted where the owner printed on it when it was granted carries the company’s own name, a former name, the name of a subsidiary its annual report lists, or its own name with a patent-holding phrase (Technology Licensing, Intellectual Property and the like), once the legal form, case and punctuation are set aside, and prints a country that name counts in. PatentsView’s data are published under the Creative Commons Attribution 4.0 licence. Source: PatentsView's granted patents and pre-grant publications, disambiguated, from the USPTO's Open Data Portal, through Dec 31, 2025, read Oct 27, 2026.

SI Assistanton AMAT · research, not advice