Patents
US patents through Dec 31, 2025 · PatentsView, from the USPTO’s Open Data Portal · read Oct 27, 2026
183 patents granted to the 2 names below, as the owner printed on each patent when it was granted. A later sale, a lapse or an expiry is not read, so this is what was granted to Chipmos Technologies Inc.’s names, not what it holds today.
Patents granted
183
182 utility, 1 reissue, 1976 to Dec 31, 2025
Granted in 2025
none
in the last year the record reads
Applications published
189
since 2001, to Dec 31, 2025
Names they are printed under
2
its own name
By yearGrantedApplications published
'05'06'07'08'09'10'11'12'13'14'15'16'17'18'19
Each pair is one calendar year. Applications are published about eighteen months after filing, so the newest years read low.
Under which name2 counted
ChipMOS Technologies Inc. its own name
TW, as the owner printed on each patent. 2 more under the same name are not counted (printed in BM)
163 publishedChipMOS Technologies Inc. its own name
named as the applicant on its applications, in TW
26 published
Newest grantseach row opens the USPTO’s own copy
| Granted | Patent | Title | Field | Owner as printed |
|---|
| Feb 19, 2019 | 10,211,142 | Chip-on-film package structure | Semiconductors | ChipMOS Technologies Inc. |
| Sep 4, 2018 | 10,068,861 | Semiconductor device | Semiconductors | ChipMOS Technologies Inc. |
| Jun 19, 2018 | 10,002,815 | Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process | Semiconductors | ChipMOS Technologies Inc. |
| Apr 24, 2018 | 9,953,960 | Manufacturing process of wafer level chip package structure having block structure | Semiconductors | ChipMOS Technologies Inc. |
| Jan 9, 2018 | 9,865,777 | Semicondcutor light-emitting device and fabricating method thereof | Semiconductors | ChipMOS Technologies Inc. |
| Jan 2, 2018 | 9,859,239 | Re-distribution layer structure and manufacturing method thereof | Semiconductors | ChipMOS Technologies Inc. |
| Dec 19, 2017 | 9,847,254 | Fingerprint sensor chip package structure and manufacturing method thereof | Semiconductors | ChipMOS Technologies Inc. |
| Oct 17, 2017 | 9,793,229 | Insulating protrusion in the trench of a re-distribution layer structure | Semiconductors | ChipMOS Technologies Inc. |
| Oct 3, 2017 | 9,780,056 | Solder ball, manufacturing method thereof, and semiconductor device | Semiconductors | ChipMOS Technologies Inc. |
| Aug 15, 2017 | 9,735,132 | Semiconductor package | Semiconductors | ChipMOS Technologies Inc. |
Newest applications publishedan application is a clue, never a plan
| Published | Application | Title | Field | Owner as printed |
|---|
| Mar 14, 2019 | 2019/0080996 | CHIP-ON-FILM PACKAGE STRUCTURE | Semiconductors | ChipMOS Technologies Inc. · patent 10,211,142 granted from it |
| Mar 1, 2018 | 2018/0061811 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Semiconductors | ChipMOS Technologies Inc. |
| Dec 7, 2017 | 2017/0352631 | SEMICONDUCTOR DEVICE | Semiconductors | ChipMOS Technologies Inc. · patent 10,068,861 granted from it |
| Nov 16, 2017 | 2017/0331006 | SEMICONDCUTOR LIGHT-EMITTING DEVICE AND FABRICATING METHOD THEREOF | Semiconductors | ChipMOS Technologies Inc. · patent 9,865,777 granted from it |
| Oct 5, 2017 | 2017/0287801 | MULTI-CHIP PACKAGE STRUCTURE MANUFACTURING PROCESS AND WAFER LEVEL CHIP PACKAGE STRUCTURE MANUFACTURING PROCESS | Semiconductors | ChipMOS Technologies Inc. · patent 10,002,815 granted from it |
| Aug 3, 2017 | 2017/0221860 | MULTI-CHIP PACKAGE STRUCTURE, WAFER LEVEL CHIP PACKAGE STRUCTURE AND MANUFACTURING PROCESS THEREOF | Semiconductors | ChipMOS Technologies Inc. · patent 9,953,960 granted from it |
| Dec 15, 2016 | 2016/0364592 | FINGERPRINT SENSOR CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Semiconductors | ChipMOS Technologies Inc. · patent 9,847,254 granted from it |
| Dec 8, 2016 | 2016/0358872 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF | Semiconductors | ChipMOS Technologies Inc. · patent 9,721,913 granted from it |
| Nov 10, 2016 | 2016/0329269 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Semiconductors | ChipMOS Technologies Inc. |
| Oct 27, 2016 | 2016/0315067 | MULTI-CHIP PACKAGE STRUCTURE, WAFER LEVEL CHIP PACKAGE STRUCTURE AND MANUFACTURING PROCESS THEREOF | Semiconductors | ChipMOS Technologies Inc. · patent 9,653,429 granted from it |
A patent is counted where the owner printed on it when it was granted carries the company’s own name, a former name, the name of a subsidiary its annual report lists, or its own name with a patent-holding phrase (Technology Licensing, Intellectual Property and the like), once the legal form, case and punctuation are set aside, and prints a country that name counts in. PatentsView’s data are published under the Creative Commons Attribution 4.0 licence. Source: PatentsView's granted patents and pre-grant publications, disambiguated, from the USPTO's Open Data Portal, through Dec 31, 2025, read Oct 27, 2026.