Company Analysis

SemiLEDS Corporation (LEDS)

Nasdaq: LEDS · Semiconductors & Related Devices · Chu-Nan, TW · filing with the SEC since 2005
Grade4.0
◀ Past 2.1● Present 4.2▶ Future 5.4

Patents

US patents through Dec 31, 2025 · PatentsView, from the USPTO’s Open Data Portal · read Oct 27, 2026

15 patents granted to the name below, as the owner printed on each patent when it was granted. A later sale, a lapse or an expiry is not read, so this is what was granted to SemiLEDS Corporation’s names, not what it holds today.

Patents granted
15
15 utility, 1976 to Dec 31, 2025
Granted in 2025
none
Against 2 in 2024 and 1 in 2023
Applications published
9
1 of them in 2025
Names they are printed under
1
its own name
By yearGrantedApplications published
'07'08'09'10'11'14'21'22'23'24'25
Each pair is one calendar year. Applications are published about eighteen months after filing, so the newest years read low.
What they are aboutgrants since 2021
Semiconductors4
The main technology area of each patent, in the World Intellectual Property Organization’s 35 fields.
Under which name1 counted
SemiLEDs Corporation its own name
TW, as the owner printed on each patent
15 granted
9 published
Newest grantseach row opens the USPTO’s own copy
Newest applications publishedan application is a clue, never a plan
PublishedApplicationTitleFieldOwner as printed
May 15, 20252025/0157859METHODS FOR FABRICATING SEMICONDUCTOR DEVICES BY FORMING AND REMOVING EPITAXIAL (EPI) STRUCTURES FROM AN ENGINEERED SUBSTRATESemiconductorsSemiLEDs Corporation
Feb 29, 20242024/0072203Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSemiconductorsSemiLEDs Corporation
May 4, 20232023/0134997Method And System For Transferring Alignment Marks Between Substrate SystemsSemiconductorsSemiLEDs Corporation · patent 12,002,792 granted from it
Jan 19, 20232023/0018855Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSemiconductorsSemiLEDs Corporation
Nov 10, 20222022/0359785Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSemiconductorsSemiLEDs Corporation · patent 11,862,755 granted from it
Oct 6, 20222022/0320366Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth SubstrateSemiconductorsSemiLEDs Corporation
Aug 25, 20222022/0271198Method For Fabricating (LED) Dice Using Semiconductor Structures On A Substrate And Laser Lift-Off To A Receiving PlateSemiconductorsSemiLEDs Corporation · patent 11,862,754 granted from it
Nov 11, 20212021/0351166Method And System For Transferring Alignment Marks Between Substrate SystemsSemiconductorsSemiLEDs Corporation · patent 11,545,474 granted from it
Mar 4, 20212021/0066541Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSemiconductorsSemiLEDs Corporation · patent 11,417,799 granted from it
What it applied for, 2024 to 2025: Semiconductors 2.

A patent is counted where the owner printed on it when it was granted carries the company’s own name, a former name, the name of a subsidiary its annual report lists, or its own name with a patent-holding phrase (Technology Licensing, Intellectual Property and the like), once the legal form, case and punctuation are set aside, and prints a country that name counts in. PatentsView’s data are published under the Creative Commons Attribution 4.0 licence. Source: PatentsView's granted patents and pre-grant publications, disambiguated, from the USPTO's Open Data Portal, through Dec 31, 2025, read Oct 27, 2026.

SI Assistanton LEDS · research, not advice